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? 2005 microchip technology inc. ds21374c-page 1 tc1263 features ? very low dropout voltage ? 500 ma output current ? high-output voltage accuracy ? standard or custom output voltages ? overcurrent and overtemperature protection ? shdn input for active power management ? error output can be used as a low battery detector (soic only) applications ? battery-operated systems ? portable computers ? medical instruments ? instrumentation ? cellular/gsm/phs phones ? linear post-regulators for smps ? pagers typical application description the tc1263 is a fixed-output, high-accuracy (typically 0.5%) cmos low dropout regulator. designed specifically for battery-operated systems, the tc1263?s cmos construction eliminates wasted ground current, significantly extending battery life. total supply current is typically 80 a at full load (20 to 60 times lower than in bipolar regulators). tc1263 key features include ultra low noise operation, very low dropout voltage (typically 350 mv at full load) and fast response to step changes in load. the tc1263 incorporates both overtemperature and overcurrent protection. the tc1263 is stable with an output capacitor of only 1 f and has a maximum output current of 500 ma. it is available in 8-pin soic, 5-pin to-220 and 5-pin ddpak packages. package type tc1263 v in v out c 1 1f gnd v out v in shdn shdn + v in gnd v out front view 12 3 ta b i s g n d tc1263 1 2 3 4 8 7 6 5 tc1263 nc shdn 8-pin soic gnd nc bypass v out v in v in v out tc1263 5-pin to-220 tab is gnd 5-pin ddpak 123 gnd shdn 45 byp byp 4 shdn 5 error 500 ma, fixed-output, cmos ldo with shutdown
tc1263 ds21374c-page 2 ? 2005 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? input voltage .........................................................6.5v output voltage................ (gnd ? 0.3v) to (v in + 0.3v) power dissipation................internally limited (note 7) voltage (max.) on any pin: (gnd ? 0.3v) to (v in + 0.3v) operating temperature range.... -40c < t j < +125c storage temperature..........................-65c to +150c ? notice: stresses above thos e listed under "maximum ratings" may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specific ation is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise indicated, v in = v r + 1.0v, (note 1) , i l = 100 a, c l = 3.3 f, shdn > v ih , t a = +25c. boldface type specifications apply for juncti on temperatures of -40c to +125c. parameters sym min typ max units conditions input operating voltage v in 2.7 ? 6.0 v note 2 maximum output current i outmax 500 ??ma output voltage v out v r ? 2.5% v r 0.5% v r + 2.5% v note 1 v out temperature coefficient v out / t ? 40 ? ppm/c note 3 line regulation v out / v in ?0.05 0.35 %(v r + 1v) v in 6v load regulation (note 4) v out /v out ?0.01 0.002 +0.01 %/ma i l = 0.1 ma to i outmax dropout voltage (note 5) v in -v out ?20 30 mv i l = 100 a ?60 130 i l = 100 ma ? 200 390 i l = 300 ma ? 350 650 i l = 500 ma supply current i dd ?80 130 a shdn = v ih , i l = 0 shutdown supply current i shdn ?0.05 1 a shdn = 0v power supply rejection ratio psrr ? 64 ? db f 1khz output short circuit current i outsc ? 1200 1400 ma v out = 0v thermal regulation v out / p d ?0.04?v/w note 6 output noise en ? 260 ? nv/ hz i l = i outmax , f = 10 kh z note 1: v r is the regulator output voltage setting. 2: the minimum v in has to justify the conditions: v in v r + v dropout and v in 2.7v for i l = 0.1 ma to i outmax . 3: 4: regulation is measured at a constant junction temperature us ing low duty-cycle pulse testing. load regulation is tested over a load range from 0.1 ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.0v differential. 6: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. specif ications are for a current pulse equal to i lmax at v in = 6v for t = 10 ms. 7: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., t a , t j , ja ). exceeding the maximum allowable power dissipation causes the device to init iate thermal shutdown. please see section 5.0 ?thermal considerations? for more details. tcv out v outmax v outmin ? () 10 6 ? v out t ------------------------------------------------------------------------- =
? 2005 microchip technology inc. ds21374c-page 3 tc1263 shdn input shdn input high threshold v ih 45 ??%v in shdn input low threshold v il ?? 15 %v in error output (soic only) minimum operating voltage v min 1.0 ? ? v output logic low voltage v ol ?? 400 mv 1 ma flows to error error threshold voltage v th ? 0.95 x v r ?v error positive hysteresis v hys ?50?mv dc characteristics (continued) electrical specifications: unless otherwise indicated, v in = v r + 1.0v, (note 1) , i l = 100 a, c l = 3.3 f, shdn > v ih , t a = +25c. boldface type specifications apply for juncti on temperatures of -40c to +125c. parameters sym min typ max units conditions note 1: v r is the regulator output voltage setting. 2: the minimum v in has to justify the conditions: v in v r + v dropout and v in 2.7v for i l = 0.1 ma to i outmax . 3: 4: regulation is measured at a constant junction temperature us ing low duty-cycle pulse testing. load regulation is tested over a load range from 0.1 ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.0v differential. 6: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, excluding load or line regulation effects. specif ications are for a current pulse equal to i lmax at v in = 6v for t = 10 ms. 7: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., t a , t j , ja ). exceeding the maximum allowable power dissipation causes the device to init iate thermal shutdown. please see section 5.0 ?thermal considerations? for more details. tcv out v outmax v outmin ? () 10 6 ? v out t ------------------------------------------------------------------------- = temperature characteristics electrical specifications: unless otherwise indicated, v in = v r + 1.0v, i l = 100 a, c l = 3.3 f, shdn > v ih , t a = +25c. parameters sym min typ max units conditions temperature ranges specified temperature range t a -40 ? +125 c note 1 operating temperature range t j -40 ? +125 c storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance, 5l-ddpak ja ?57?c/w thermal resistance, 5l-to-220 ja ?71?c/w thermal resistance, 8l-soic ja ? 163 ? c/w note 1: operation in this range must not cause t j to exceed maximum junction temperature (+125c).
tc1263 ds21374c-page 4 ? 2005 microchip technology inc. 2.0 typical performance curves note: unless otherwise indicated, v in = v r + 1.0v, i l = 100 a, c l = 3.3 f, shdn > v ih , t a = +25c. figure 2-1: line regulation vs. temperature. figure 2-2: output noise vs. frequency. figure 2-3: load regulation vs. temperature. figure 2-4: i dd vs. temperature. figure 2-5: 2.5v dropout voltage vs. i load . figure 2-6: 5.0v dropout voltage vs. i load . note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0 . 020 0 . 018 0 . 016 0 . 012 0 . 010 0 . 008 0 . 006 0 . 004 0 . 002 0 . 000 0 . 014 te m pe ra t ur e ( c ) li n e r eg u l a tio n ( % ) - 40 c0 c25 c70 c85 c 125 c f r eq u e nc y ( k h z ) n oise ( v/ h z ) 10 . 0 1 . 0 0 . 01 0 . 01 1 10 100 1000 0 . 1 0 . 0 r lo ad = 50 c o u t = 1 f -40 c 0 c25 c70 c85 c 125 c 0.0100 0.0090 0.0080 0.0070 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 0.0100 temperature ( c) load regulation (%/ma) 1ma to 500ma 1ma to 500ma 5v 2.5v te m pe ra t ur e ( c ) i dd ( a ) 150 135 120 105 90 75 60 45 30 15 0 5 v - 40 c0 c25 c70 c85 c 125 c 2 . 5 v 0 100 200 300 400 500 i lo ad ( m a ) dr opo u t volt a ge ( v ) 0 . 50 0 . 40 0 . 30 0 . 20 0 . 10 0 . 00 - 40 c 0 c 70 c 85 c 25 c 125 c 0 100 200 300 400 500 i lo ad ( m a ) 0 . 50 0 . 40 0 . 30 0 . 20 0 . 10 0 . 00 dr opo u t volt a ge ( v ) 25 c - 40 c 0 c 70 c 85 c 125 c
? 2005 microchip technology inc. ds21374c-page 5 tc1263 note: unless otherwise indicated, v in = v r + 1.0v, i l = 100 a, c l = 3.3 f, shdn > v ih , t a = +25c. figure 2-7: 2.5v v out vs. temperature. figure 2-8: 5.0v v out vs. temperature. 2 . 70 2 . 50 2 . 30 2 . 10 1 . 90 1 . 70 1 . 50 - 40 c0 c25 c70 c85 c 125 c te m pe ra t ur e ( c ) i l = 0 . 1 m a i l = 300 m a i l = 500 m a v o u t ( v ) 5 . 20 5 . 10 5 . 00 4 . 90 4 . 80 4 . 70 4 . 60 4 . 50 4 . 40 4 . 30 4 . 20 4 . 10 4 . 00 - 40 c0 c25 c70 c85 c 125 c te m pe ra t ur e ( c ) v o u t ( v ) i l = 0 . 1 m a i l = 300 m a i l = 500 m a
tc1263 ds21374c-page 6 ? 2005 microchip technology inc. 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 regulated output voltage (v out ) v out is a regulated voltage output. 3.2 ground (gnd) ground terminal. 3.3 reference bypass (bypass) reference bypass input. connect a 470 pf to the bypass input to further reduce output noise. 3.4 out-of-regulation flag (error ) out-of-regulation flag (open-drain output). error goes low when v out is out-of-tolerance by approximately ? 5%. 3.5 shutdown control (shdn ) shutdown control input. the regulator is fully enabled when a logic-high is applied to shdn . the regulator enters shutdown when a logic-low is applied to this input. during shutdown, output voltage falls to zero and supply current is reduced to 0.05 a (typical). 3.6 unregulated supply (v in ) v in is an unregulated supply input. pin no. (8-pin soic) pin no. (5-pin ddpak) (5-pin to-220) symbol description 15v out regulated voltage output 2 3 gnd ground terminal 3 ? nc no connect 4 1 bypass reference bypass input 5 ? error out-of-regulation flag (open-drain output). 6 2 shdn shutdown control input 7 ? nc no connect 84v in unregulated supply input
? 2005 microchip technology inc. ds21374c-page 7 tc1263 4.0 detailed description the tc1263 is a precision, fixed-output ldo. unlike bipolar regulators, the tc1263?s supply current does not increase with load current. in addition, v out remains stable and within regulation over the entire 0ma to i loadmax load current range (an important consideration in rtc and cmos ram battery back-up applications). figure 4-1 shows a typical application circuit. figure 4-1: typical application circuit. 4.1 output capacitor a 1 f (min.) capacitor from v out to ground is required. the output capacitor should have an effective series eesistance (esr) greater than 0.1 and less than 5 . a 1 f capacitor should be connected from v in to gnd if there is either more than 10 inches of wire between the regulator and the ac filter capacitor or a battery is used as the power source. aluminum electrolytic or tantalum capacitor types can be used. since many aluminum electrolytic capacitors freeze at approximately -30c, solid tantalums are recommended for applications operating below -25c. when operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors, and by employing passive filtering techniques. 4.2 error output error is driven low whenever v out falls out of regulation by more than ? 5% (typ.). this condition may be caused by low input voltage, output current limiting or thermal limiting. the error threshold is 5% below rated v out , regardless of the programmed output voltage value (e.g., error = v ol at 4.75v (typ.) for a 5.0v regulator and 2.85v (typ.) for a 3.0v regulator). error output operation is shown in figure 4-2. note that error is active when v out is at or below v th , and inactive when v out is above v th + v hys . as shown in figure 4-1, error can be used as a battery-low flag or as a processor reset signal (with the addition of timing capacitor c 3 ). r 1 x c 3 should be chosen to maintain error below v ih of the processor reset input for at least 200 ms to allow time for the system to stabilize. pull-up resistor r 1 can be tied to v out , v in or any other voltage less than (v in + 0.3v). figure 4-2: error output operation. c 1 r 1 1m v + tc1263 v in battery v out error shdn gnd v out 1f + + shutdown control (to cmos logic or tie to v in , if unused) c 2 1f + c 3 required only if error is used as a processor reset signal (see text) c 3 0.2 f + battlow or reset v out v th v oh hysteresis (v hys ) v ol error
tc1263 ds21374c-page 8 ? 2005 microchip technology inc. 5.0 thermal considerations 5.1 thermal shutdown integrated thermal protection circuitry shuts the regulator off when the die temperature exceeds 160c. the regulator remains off until the die temperature drops to approximately 150c. 5.2 power dissipation the amount of power the regulator dissipates is primarily a function of input and output voltage and out- put current. the following equation is used to calculate worst-case actual power dissipation: equation 5-1: the maximum allowable power dissipation (equation 5-2) is a function of the maximum ambient temperature (t amax ), the maximum allowable die temperature (t jmax ) and the thermal resistance from junction-to-air ( ja ). equation 5-2: table 5-1 and table 5-2 show various values of ja for the tc1263 package types. table 5-1: thermal resistance guidelines for tc1263 in 8-pin soic package table 5-2: thermal resistance guidelines for tc1263 in 5-pin ddpak/to-220 package equation 5-1 can be used in conjunction with equation 5-2 to ensure regulator thermal operation is within limits. for example: find: 1. actual power dissipation 2. maximum allowable dissipation actual power dissipation: maximum allowable power dissipation: in this example, the tc1263 dissipates a maximum of 260 mw below the allowable limit of 500 mw. in a similar manner, equation 5-1 and equation 5-2 can be used to calculate maximum current and/or input voltage limits. for example, the maximum allowable v in is found by substituting the maximum allowable power dissipation of 500 mw into equation 5-1, from which v inmax = 4.6v. copper area (topside)* copper area (backside) board area thermal resistance ( ja ) 2500 sq mm 2500 sq mm 2500 sq mm 60c/w 1000 sq mm 2500 sq mm 2500 sq mm 60c/w 225 sq mm 2500 sq mm 2500 sq mm 68c/w 100 sq mm 2500 sq mm 2500 sq mm 74c/w * pin 2 is ground. device is mounted on top-side. where: v inmax v outmin i loadmax p d = worst-case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p d v inmax v outmin ? () i loadmax = where: v inmax v outmin i loadmax p d = worst-case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p dmax t jmax t amax ? ja -------------------------------------- - = copper area (topside)* copper area (backside) board area thermal resistance ( ja ) 2500 sq mm 2500 sq mm 2500 sq mm 25c/w 1000 sq mm 2500 sq mm 2500 sq mm 27c/w 125 sq mm 2500 sq mm 2500 sq mm 35c/w * tab of device attached to top-side copper given: v inmax =3.3v 10% v outmin =2.7v 0.5% i loadmax =275ma t jmax =125c t amax =95c ja = 60 c/w (soic) p d v inmax v outmin ? () i loadmax p d 3.3 1.1 () 2.7 .995 () ?27510 3 ? = p d 260 mw = p dmax t jmax t amax ? ja -------------------------------------- - = p dmax 125 95 ? () 60 ------------------------- = p dmax 500 mw =
? 2005 microchip technology inc. ds21374c-page 9 tc1263 6.0 packaging information 6.1 package marking information xxxxxxxxx xxxxxxxxx yywwnnn 5-lead ddpak tc1263 3.3vet example: 5-lead to-220 xxxxxxxxx xxxxxxxxx yywwnnn example: tc1263 - 3.3vat x 0430256 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn 1263 -3.3 voa0430 256 0430256 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e
tc1263 ds21374c-page 10 ? 2005 microchip technology inc. 5-lead plastic (et) (ddpak) bottom view top view e d b e1 d2 a a1 c2 c l d1 e 1 (5x) l 3 1 significant charact e ristic drawing no. c04-012 not e s: mold draft angl e dim e nsions d and e do not includ e mold flash or protrusions. mold flash or protrusions shall not e xc ee d .010" (0.254mm) p e r sid e . 1 7 pitch numb e r of pins ov e rall width standoff mold e d packag e l e ngth expos e d pad width ov e rall h e ight max units dim e nsion limits a1 e1 d e e a . 3 98 .000 .256 ref inches* .067 bsc min 5 nom max .010 0.00 10.11 6.50 ref millimeters .18 3 min 5 1.70 bsc nom 0.25 4.65 jedec e quival e nt: to-252 4.50 .170 .005 0.1 3 foot l e ngth l .068 .089 .110 1.7 3 2.26 2.79 foot angl e -- -- 8 .177 *controlling param e t e r 4. 3 2 . 3 85 .410 9.78 10.41 . 33 0. 3 50 . 3 70 8. 3 88.899.40 ov e rall l e ngth d1 .549 .577 .605 1 3 .94 14.66 15. 3 7 l e ad thickn e ss c .014 .020 .026 0. 3 60.510.66 pad thickn e ss c2 .045 -- .055 1.14 -- 1.40 l e ad width .0 3 7 b .026 .0 3 2 0.66 0.81 0.94 3 -- 8 7 3 -- -- -- expos e d pad l e ngth d2 . 3 0 3 ref 7.75 ref pad l e ngth l 3 .045 -- .067 1.14 -- 1.70
? 2005 microchip technology inc. ds21374c-page 11 tc1263 5-lead plastic transistor outline (at) (to-220) l h1 q e b e1 e c1 j1 f a d a (5x) ?p ejector pin e3 drawing no. c04-036 notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010" (0.254mm) per side. jedec equivalent: to-220 *controlling parameter mold draft angle lead width lead thickness a c1 b .014 dimension limits overall height lead length overall width lead pitch a l e .540 min e units .060 inches* .022 0.36 0.56 millimeters .190 .560 13.72 min max 4.83 14.22 max .160 4.06 3 7 3 7 overall length d 1.02 0.64 .040 .025 overall lead centers e1 .263 .385 .560 .273 6.68 6.93 .072 1.52 1.83 .415 9.78 10.54 .590 14.22 14.99 through hole diameter p .146 .156 3.71 3.96 j1 base to bottom of lead .090 2.29 .115 2.92 through hole center q .103 2.87 .113 2.62 flag thickness f .045 1.40 .055 1.14 flag length h1 .234 6.55 .258 5.94 space between leads e3 .030 1.02 .040 0.76
tc1263 ds21374c-page 12 ? 2005 microchip technology inc. 8-lead plastic small outline (sn) ? narrow, 150 mil body (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
? 2005 microchip technology inc. ds21374c-page 13 tc1263 appendix a: revision history revision c (january 2005) the following is the list of modifications: 1. changes to dc characteristics table 2. added appendix a: revision history. revision b (may 2002) no information for this revision. revision a (march 2002) original data sheet release.
tc1263 ds21374c-page 14 ? 2005 microchip technology inc. notes:
? 2005 microchip technology inc. ds21374c-page 15 tc1263 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device tc1263 fixed output cmos ldo with shutdown voltage option:* 2.5 = 2.5v 2.8 = 2.8v 3.0 = 3.0v 3.3 = 3.3v 5.0 = 5.0v * other output voltages are available. please contact your local microchip sales office for details. temperature range: v = -40c to +125c package at = plastic (to-220), 5-lead et = plastic transistor outline (ddpak), 5-lead ettr = plastic transistor outline (ddpak), 5-lead, tape and reel oa = plastic soic, (150 mil body), 8-lead oatr = plastic soic, (150 mil body), 8-lead, tape and reel part no. x.x xx package voltage option device examples: a) tc1263-2.5vat 2.5v ldo, to-220-5 pkg. b) tc1263-2.8vat 2.8v ldo, to-220-5 pkg. c) tc1263-3.0vat 3.0v ldo, to-220-5 pkg. d) tc1263-3.3vat 3.3v ldo, to-220-5 pkg. e) tc1263-5.0vat 5.0v ldo, to-220-5 pkg. a) tc1263-2.5vettr 1.8v ldo, ddpak-5 pkg., tape and reel b) tc1263-2.8vettr 2.5v ldo, ddpak-5 pkg., tape and reel c) tc1263-3.0vettr 3.0v ldo, ddpak-5 pkg., tape and reel d) tc1263-3.3vettr 3.3v ldo, ddpak-5 pkg., tape and reel a) tc1263-2.5voa 1.8v ldo, soic-8 pkg. b) tc1263-2.5voatr 1.8v ldo, soic-8 pkg., tape and reel c) tc1263-2.8voa 2.5v ldo, soic-8 pkg. d) tc1263-2.8voatr 2.5v ldo, soic-8 pkg., tape and reel e) tc1263-3.0voa 3.0v ldo, soic-8 pkg. f) tc1263-3.0voatr 3.0v ldo, soic-8 pkg., tape and reel g) tc1263-3.3voa 3.3v ldo, soic-8 pkg. h) tc1263-3.3voatr 3.3v ldo, soic-8 pkg., tape and reel i) tc1263-5.0voa 5.0v ldo, soic-8 pkg. xx tape and reel x temperature range
tc1263 ds21374c-page 16 ? 2005 microchip technology inc. notes:
? 2005 microchip technology inc. ds21374c-page 17 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application m eets with your specifications. microchip makes no representations or war- ranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, migratable memory, mxdev, mxlab, picmaster, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, app lication maestro, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, mpasm, mplib, mplink, mpsim, pickit, picdem, picd em.net, piclab, pictail, powercal, powerinfo, powermate, powertool, rflab, rfpicdem, select mode, smart serial, smarttel and total endurance are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2005, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outsi de the operating specifications c ontained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer c an guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted wo rk, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona and mountain view, california in october 2003. the company?s quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
ds21374c-page 18 ? 2005 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta alpharetta, ga tel: 770-640-0034 fax: 770-640-0307 boston westford, ma tel: 978-692-3848 fax: 978-692-3821 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 san jose mountain view, ca tel: 650-215-1444 fax: 650-961-0286 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8676-6200 fax: 86-28-8676-6599 china - fuzhou tel: 86-591-8750-3506 fax: 86-591-8750-3521 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - shunde tel: 86-757-2839-5507 fax: 86-757-2839-5571 china - qingdao tel: 86-532-502-7355 fax: 86-532-502-7205 asia/pacific india - bangalore tel: 91-80-2229-0061 fax: 91-80-2229-0062 india - new delhi tel: 91-11-5160-8631 fax: 91-11-5160-8632 japan - kanagawa tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 taiwan - hsinchu tel: 886-3-572-9526 fax: 886-3-572-6459 europe austria - weis tel: 43-7242-2244-399 fax: 43-7242-2244-393 denmark - ballerup tel: 45-4450-2828 fax: 45-4485-2829 france - massy tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - ismaning tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 england - berkshire tel: 44-118-921-5869 fax: 44-118-921-5820 w orldwide s ales and s ervice 10/20/04

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